Hot bending strength of ceramics - Testing your technical ceramics at high temperatures
Test method for determining the flexural strength at high temperatures
If the requirements or the statements from the bending tests at room temperature (cold bending strength) are not sufficient, the conditions can be adapted to the application. The hot bending strength describes a test method for determining the bending strength in a 3-point test at temperatures above room temperature. For refractory materials, the test is specified in DIN EN 993-7.
We offer you the corresponding tests. The hot bending strength of ceramic specimens can be determined at WZR ceramic solutions at temperatures up to 1500°C. The temperature is set according to the specific task, so that we can respond to your specific requirements. Due to a special design, it is also possible to determine the E-modulus or V-modulus of your sample.
How do we test the hot bending strength?
Analogous to the 3-point bending test at room temperature, here the specimen is bedded on 2 rollers and heated to the desired temperature. A thermocouple located nearby ensures accuracy. After a short rest phase, a stamp is applied to the sample from above, which applies increasing force to the sample until it breaks.
In addition, the deflection of the sample during increasing load until break can be recorded. This enables the calculation of the Young’s modulus or the V-modulus.
Where are the limits of hot bending strength?
We test the hot bending strength of materials up to a maximum temperature of 1500°C. A specimen geometry that allows your material to be tested is necessary. In addition, knowledge of the field of application and the thermal behaviour of your material is necessary to optimally adapt the test temperature to your material.
We would be pleased to contact you to discuss the possibilities of hot bending strength testing of your ceramic.
What other testing methods does WZR offer at high temperatures?
In addition to the testing of thermal elongation we offer the testing of thermal expansion.